JPH0322706B2 - - Google Patents
Info
- Publication number
- JPH0322706B2 JPH0322706B2 JP8182785A JP8182785A JPH0322706B2 JP H0322706 B2 JPH0322706 B2 JP H0322706B2 JP 8182785 A JP8182785 A JP 8182785A JP 8182785 A JP8182785 A JP 8182785A JP H0322706 B2 JPH0322706 B2 JP H0322706B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thermal expansion
- semiconductor element
- coefficient
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910001374 Invar Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8182785A JPS61240665A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8182785A JPS61240665A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61240665A JPS61240665A (ja) | 1986-10-25 |
| JPH0322706B2 true JPH0322706B2 (en]) | 1991-03-27 |
Family
ID=13757304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8182785A Granted JPS61240665A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61240665A (en]) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104641U (en]) * | 1989-02-06 | 1990-08-20 | ||
| JP2777464B2 (ja) * | 1990-07-18 | 1998-07-16 | 株式会社日立製作所 | 電子装置と、これを用いたエンジンの点火装置 |
| JP2546342Y2 (ja) * | 1991-07-22 | 1997-08-27 | 三洋電機株式会社 | 混成集積回路 |
| JPH0515440U (ja) * | 1991-07-31 | 1993-02-26 | 京セラ株式会社 | 光半導体素子収納用パツケージ |
| JPH06188324A (ja) * | 1992-12-16 | 1994-07-08 | Kyocera Corp | 半導体装置 |
| DE69603664T2 (de) * | 1995-05-30 | 2000-03-16 | Motorola, Inc. | Hybrid-Multichip-Modul und Verfahren zur seiner Herstellung |
| US20040216864A1 (en) * | 2003-04-30 | 2004-11-04 | Wong Marvin Glenn | CTE matched application specific heat sink assembly |
| JP2006013368A (ja) * | 2004-06-29 | 2006-01-12 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
| JP4450230B2 (ja) | 2005-12-26 | 2010-04-14 | 株式会社デンソー | 半導体装置 |
-
1985
- 1985-04-17 JP JP8182785A patent/JPS61240665A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61240665A (ja) | 1986-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |